Overview
Copper plating creates an outstanding barrier layer that can cover substrate metals and alloys. Copper plating provides an easy-to-plate, level, and in some cases, smooth substrate, making it even more popular than nickel plating for certain metal finishing applications. Although it can be used independently, copper is typically used as an under plate for deposits such as nickel, tin, tin/lead, gold or silver.
Copper plating provides an excellent diffusion barrier which prevents components of the base material from migrating into the subsequent plating layers. Copper plating generates high electrical conductivity, which has made it an excellent and inexpensive choice for high tech products as well as other applications.
Key Performance of Copper Electroplating:
Specifications:
| Copper Electroplating Capabilities | ||
| Electroplating Material | Copper | |
| Copper Alloy (Non Ferrous) Substrates | Beryllium Copper (BeCu) | Copper |
| Tellurium Copper (TeCu) | Brass | |
| Leaded Brass | ||
| Nickel Alloy (Ferrous) Substrates | Carbon Steel | Nickel |
| Leaded Steel | Spring Steel | |
| Stainless Steel | Molybdenum | |
| Kovar | Elkonite | |
| Invar | Alloy 42 | |
| Specifications | AMS-2418 | ASTM B734 |
| ASTM B689 | MIL-C-14550 | |
| Plating Characteristics | Excellent Diffusion Barrier | High Electrical Conductivity |
| Easy to Plate and Level Substrate | Ductile and can be Buffed for Aesthetic Value | |
| Process | Electroplating | Deburring |
| Cleaning | Vibratory Finishing | |
| Tumbling | ||
| Application | Rack | |
| Barrel | ||
| Automation Capabilities | PLC Controlled Process | |
| Pre-Plate Operations | Etching | Masking |
| Bright dip | Tumbling | |
| Post Plate | Chromate | Dip Spin Laquer |
| Heat Treat | ||
| Electroplating Thickness | 5 to 500 µin | |
| Part Width | Up to 12 in | |
| Inspection | Microscope (Visual up to 500x) | |
| Testing Ability | X-Ray Fluorescence | Steam Age/ Salt Spray |
| (Thickness / Composition) | Ammonium Sulfide | |
| Cross Section | Copper Sulfate | |
| Hardness | Potassium Hydroxide | |
| Solderability | Eddy Current | |
| Bake | AA (Atomic Absorption | |
| Adhesion | Spectroscopy) | |
| Purity | ||
| Product Volume | 1 to 1,000,000 pieces | Prototype to Large Volume Production |
| Typical Lead Times Available | 3 to 5 days | |
| KANBAN / Inventory Management System | ||
| Quality | Statistical Process Control | Control Plans |
| Traceability | Process Validation Protocol | |
| Web Based Tracking | Equipment Validation Protocol | |
| PPAP | Lean Six Sigma | |
| PFMEA | ISO9001:2008 Certified | |
| Documentation | Certificate of Conformance | |
| Packing List | ||
| Additional Information | ||
| Industry Focus | Medical | Military |
| Automotive | RF Microwave | |
| Fastener | Battery/ Hardware | |
| Intended Applications | Safety Critical Parts | |
| High Reliability Parts | ||
| Certifications | ISO 9001:2008 | |
| Industry Standards | ASTM | RoHS |
| Mil-Spec | EEIC | |
| File Formats | ||
| TIFF | ||
| RTF | ||