Overview
Tin plating is used in applications to protect ferrous and nonferrous surfaces. Components that require tin plating are those commonly used in electronics, automotive, appliances, computer hardware, medical and food processing. Because tin has great ductility it allows a coated base metal sheet to form many different shapes without damaging the surface tin plating layer. Tin plating also provides sacrificial protection for copper, nickel, and other non-ferrous metals, with the exception of steel.
DiFruscia Industries offers lead free tin plating to preserve the solderability of underplated deposits and to offer corrosion protection and superior electrical conductivity where it’s needed.
Key Performance Properties of Tin Plating:
Specifications:
Tin Electroplating Capabilities | ||
Electroplating Material | Tin | |
Copper Alloy (Non Ferrous) Substrates | Beryllium Copper (BeCu) | Copper |
Tellurium Copper (TeCu) | Brass | |
Zinc Diecasting | Leaded Brass | |
Nickel Alloy (Ferrous) Substrates | Carbon Steel | Nickel |
Leaded Steel | Spring Steel | |
Stainless Steel | Molybdenum | |
Kovar | Elkonite | |
Invar | Alloy 42 | |
Specifications | MIL-T-10727 | ASTM B545 |
AMS 2408 | ||
Electroplating Characteristics | Anti-galling | Corrosion Resistance |
Ductility | Low Contact Resistancne | |
No Whiskering | Solderability | |
Thermal Conductivity | ||
Process | Electroplating | Deburring |
Electroless | Vibratory Finishing | |
Cleaning | Tumbling | |
Application | Rack | Vibratory |
Barrel | Selective | |
Automation Capabilities | PLC Controlled Process | |
Pre-Plate Operations | Etching | Masking |
Degrease | Descale | |
Vibratory | ||
Post Plate | Baking | |
Electroplating Thickness | 5 to 500 µin | |
Part Width | Up to 12 in | |
Inspection | Microscope (Visual up to 500x) | |
Testing Ability | X-Ray Fluorescence | Steam Age/ Salt Spray |
(Thickness / Composition) | Ammonium Sulfide | |
Cross Section | Copper Sulfate | |
Hardness | Potassium Hydroxide | |
Solderability | Eddy Current | |
Bake | AA (Atomic Absorption | |
Adhesion | Spectroscopy) | |
Purity | ||
Product Volume | 1 to 1,000,000 pieces | Prototype to Large Volume Production |
Typical Lead Times Available | 3 to 5 days | |
KANBAN / Inventory Management System | ||
Quality | Statistical Process Control | Control Plans |
Traceability | Process Validation Protocol | |
Web Based Tracking | Equipment Validation Protocol | |
PPAP | Lean Six Sigma | |
PFMEA | ISO9001:2008 Certified | |
Documentation | Certificate of Conformance | |
Packing List | ||
Additional Information | ||
Industry Focus | Medical | Military |
Automotive | RF Microwave | |
Fastener | Battery/ Hardware | |
Intended Applications | Safety Critical Parts | |
High Reliability Parts | ||
Certifications | ISO 9001:2008 | |
Industry Standards | ASTM | RoHS |
Mil-Spec | EEIC | |
File Formats | ||
TIFF | ||
RTF |